Table of contents
Thick Film Superconductors — Preliminary Results
M. Hrovat, S. Bernik, D. KolarA superconducting material with the composition YBa1.8Pb0.2Cu3O7 was synthesised. The influence of PbO addition on the sintering and formation of the superconducting compound…
Twenty Years of Neurological Prosthesis‐making
P.E.K. DonaldsonThe UK Medical Research Council's Neurological Prosthesis Unit was formed on 1 October 1968. In this review, Peter Donaldson, who has been with the unit from the beginning…
Photonic Systems Interconnections—Overcoming the High Speed Electronics Bottleneck
D.H. HartmanFundamental engineering limits to very high speed electronics switching systems are employed. These limitations are caused by packaging and interconnection constraints, as well as…
Discrimination of Chemical Compounds and Functional Groups by Pattern Recognition Using an Integrated Sensor
T. Oishi, M. Kaneyasu, A. IkegamiAn integrated sensor with three elements (zinc oxide, tin oxide and tungsten oxide) was fabricated by thick film techniques in order to develop a smell sensor. Using this sensor…
Fatigue Fracture of Leads of SMT Components Caused by Ultrasonic Cleaning
E.E. de KluizenaarUltrasonic cleaning is an effective aid in the removal of flux residues from surface mounted circuits. However, an over‐intensive and too extended ultrasonic load of…
Copper‐On‐Ceramic Technology Development
M. PorterThis paper acts as an introduction to the work of the Microelectronics Technology Centre of British Aerospace at Hatfield. It concentrates, primarily, on the development of a…
Present State of Directly Solderable Copper PTF
M. Tsunaga, S. KatoThis paper describes a newly developed Copper PTF (Polymer Thick Film) which is characterised by direct solderability and high electrical conductivity. This Copper PTF claims to…
Accelerated Life Test of Thick Film Resistors
L. Golonka, J. Kozlowski, K. NitschThe rapid assessment of thick film resistor reliability is presented. This relies on the application of constant power pulses. The long‐term stability of the resistors is…
Two Thick Film Thermal Sensors
T. KwikkersFor the production of sensor elements, thick film technology can be used. Advantages of this technology such as ease of production, low cost, high reliability and the possibility…
Copper Ball‐wedge Bonding and Its Problems
L. TielemansAn evaluation of the feasibility of copper ball‐wedge bonding on Au, Cu thick film and aluminium metallisations was carried out. This evaluation is not merely a check for…
The Surfactant Flux—A New Flux for the Ozone Age
G. Becker, A. Biverstedt, A. TolvgårdThe development of a new type of flux—the surfactant flux—is described. This flux is applied in a very thin layer and must be totally dry before soldering. It is not necessary to…
Nokia Electronics, Helsinki, Finland
R.B. TurnbullScandinavia is always one of my favourite destinations for a number of reasons. First of all, I like the cleanliness of the atmosphere which certainly helps to keep one fresh at…
ISHM news
T. Kwikkers, J. Lantaires, R.B. Turnbull, H.T. Law, Barry George, Dave SavageOn 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used…
Industry news
R.B. TurnbullITS: Intertrade Scientific Ltd, the UK based manufacturer of the MCT/Browne InfraRed Reflow Soldering Systems for SMT and Hybrid applications, as part of their aggressive drive…
New products
Augat/Isotronics now offer injection moulded, glass‐to‐metal sealed hybrid circuit packages providing many advantages over conventional machined components.
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson