Table of contents
Some results obtained with diffusion patterning technology
Darko Belavic, Marko Hrovat, Marko Pavlin, Janez HolcDiffusion patterning is a dielectric patterning technology, which is used in the screen printed thick film technology for higher density multilayer circuits. This technology is…
Development of a reliable packaging process for flip chip on ceramics
Zhaowei ZhongA reliable packaging process for flip chip on ceramic substrate using gold bumps and adhesive was successfully developed. The bonding parameters and flip chip assemblies using…
Thick film microstrip rejection filter with improved Q using overlay
Sunit Rane, Vijaya PuriIn this paper studies on the lab formulated fritless silver thick film paste with two different binder compositions that have been used to fabricate λ/2 microstrip rejection…
New approach for calculation of line parameters of IC interconnects
Hasan Ymeri, Bart Nauwelaers, Karen Maex, David De RoestA new method for analysis of IC interconnects propagation parameters is suggested. A potential integral formalism is employed that enables us to express general solutions for the…
Substrate characterization: simulation and measurement at high microwave frequencies
Charles Free, Zhengrong Tian, Peter BarnwellIn this paper we present new measured loss tangent data for commercially available substrates, and these data are supported by simulations that show how practical variations in…
Computational and experimental approach to thermal management in microelectronics and packaging
Cosme Furlong, Ryszard J. PryputniewiczNew and ever more demanding applications of microelectronics require advances in design and optimization of components and packages, in relatively short periods of time, while…
Effects of aspect ratio on the temperature coefficient of resistance matching and low frequency noise levels in thick film strain sensors
J.K. Atkinson, R.P. Sion, Z. ZhangAn experimental study of thick film strain sensitive resistors as typically employed in resistive bridge interface circuits has been undertaken. It has been found that the chosen…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson