International Journal of Numerical Methods for Heat & Fluid Flow: Volume 15 Issue 1
Table of contents
Analysis and optimization of the thermal performance of microchannel heat sinks
Dong Liu, Suresh V. GarimellaTo provide modeling approaches of increasing levels of complexity for the analysis of convective heat transfer in microchannels which offer adequate descriptions of the thermal…
Optimization of thermal resistance of stacked micro‐channel using genetic algorithms
K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid, Z.A. ZainalTo determine the optimal dimensions for a stacked micro‐channel using the genetic algorithms (GAs) under different flow constraints.
Thermal analysis of micro‐channel heat exchangers with two‐phase flow using FEM
Pradeep Hegde, K.N. Seetharamu, G.A. Quadir, P.A. Aswathanarayana, M.Z. Abdullah, Z.A. ZainalTo analyze two‐phase flow in micro‐channel heat exchangers used for high flux micro‐electronics cooling and to obtain performance parameters such as thermal resistance, pressure…
Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages
Ravi Kandasamy, Suresh SubramanyamIn the semiconductor electronics industry, effective heat removal from the integrated circuits (IC) chip, through the electronic package to the environment is crucial to maintain…
Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme
P. Nithiarasu, N. Massarotti, J.S. MathurTo numerically model forced convection heat transfer over arrays of solder balls.
Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
Shiao Lin Beh, C.K. Ooi, G.A. Quadir, K.N. SeetharamuTo provide some new and additional data for the design of a triple stack cold plate.
ISSN:
0961-5539Online date, start – end:
1991Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Prof Roland Lewis