Table of contents - Special Issue: IMAPS 2019
Guest Editors: Agata Skwarek
The influence of soldering process parameters on the optical and thermal properties of power LEDs
Przemysław Ptak, Krzysztof Górecki, Agata Skwarek, Krzysztof Witek, Jacek TarasiukThis paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs.
Low-voiding solder pastes in LED assembly
Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek, Sebastian WrońskiThis paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…
Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel DušekThe purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure…
Selective etching and hardness properties of quenched SAC305 solder joints
Muhamad Zamri Yahaya, Nor Azmira Salleh, Soorathep Kheawhom, Balazs Illes, Muhammad Firdaus Mohd Nazeri, Ahmad Azmin MohamadThe purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions.
Structural characterization of inkjet printed capacitor layers in various technological conditions
Milena Kiliszkiewicz, Dariusz Przybylski, Jan Felba, Ryszard KorbutowiczThe purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive…
Impact of convection on thermographic analysis of silver based thermal joints
Krzysztof Jakub Stojek, Jan Felba, Johann Nicolics, Dominik WołczyńskiThis paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for…
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Daniel Straubinger, István Bozsóki, Balazs Illes, Oliver Krammer, David Bušek, Attila GeczyThe paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed…
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
Mohamed Amine Alaya, Viktória Megyeri, David Bušek, Gábor Harsányi, Attila GeczyTo improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring…
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ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang