Table of contents
Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys
Mohammad Gharaibeh, Aaron J. Stewart, Quang T. Su, James M. PitarresiThis paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder…
Influence of thermal shock cycles on Sn-37Pb solder bumps
Guisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping WuWith continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to…
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej PašákThis study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first…
Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu BakarThe purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.
Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok, Norinsan Kamil OthmanThis study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package.
Rheology of F620 solder paste and flux
Flavia V. Barbosa, José C.F. Teixeira, Senhorinha F.C.F. Teixeira, Rui A.M.M. Lima, Delfim F. Soares, Diana M.D. PinhoThe aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of…
Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering
Jose James, Bhavani Rao R., Gabriel NeamtuOffering unskilled people training in engineering and vocational skills helps to decrease unemployment rate. The purpose of this paper is to augment actual hands-on conventional…
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ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang