Table of contents
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study
Jagjiwan Mittal, Kwang-Lung LinThis paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation…
Growth kinetics of IMC at the solid Cu/liquid Sn interface
Zuozhu Yin, Fenglian Sun, Yang Liu, Yang LiuThe purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.
Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders
Yu Tang, Shaoming Luo, Guoyuan Li, Zhou Yang, Chaojun HouThe purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x …
Optimising pin-in-paste technology using gradient boosted decision trees
Péter Martinek, Oliver KrammerThis paper aims to present a robust prediction method for estimating the quality of electronic products assembled with pin-in-paste soldering technology. A specific board quality…
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach
Mohammad GharaibehThis paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis…
Effects of solder paste on thermal and optical performance of high-power ThinGaN white LED
Muna E. Raypah, Mutharasu Devarajan, Fauziah SulaimanThermal management of high-power (HP) light-emitting diodes (LEDs) is an essential issue. Junction temperature (TJ) and thermal resistance (Rth) are critical parameters in…
Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, R. IsmailThe relationship between the bulk and localized mechanical properties is critically needed, especially to understand the mechanical performance of solder alloy because of smaller…
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ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang