Table of contents
Laser soldering control using optical imaging
James M. Gilbert, Zaif DabestaniThe use of lasers to selectively solder joints in electronic assemblies has a number of advantages over methods which involve heating of the whole assembly. However, the localised…
Reliability of ACA bonded flip chip joints on LCP and PI substrates
Laura Frisk, Anne CuminiThe purpose of this study is to investigate the reliability of flip chip joints made with anisotropic conductive adhesives (ACA) on flexible polyimide (PI) and liquid crystal…
Failure analysis techniques for lead‐free solder joints
Todd Castello, Dan Rooney, Dongkai ShangguanThis paper aims to describe and document the application of commonly utilized solder joint failure analysis techniques to lead‐free solder joints.
The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints
Laura Frisk, Kati KokkoThe purpose of this study is to investigate the effect of chip and substrate thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive…
Determining conformal coating protection
Christopher Hunt, Angela Mensah, Anthony Buxton, Richard HolmanThis work sets out to characterise the protective properties of conformal coatings and how they degrade.
The effect of reflow profile on SnPb and SnAgCu solder joint shear strength
Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou, Wesley J. DeeThe purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.
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ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang