Circuit World: Volume 33 Issue 2

Regulations and market trends in lead‐free and halogen‐free electronics

This paper seeks to investigate the electronics industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

Printed circuit boards for lead‐free soldering: materials and failure mechanisms

This paper aims to evaluate the influence of previous exposure to moisture on delamination and formation of CAF (conductive anodic filament) in printed circuit boards used for…

New epoxy resins for printed wiring board applications

This paper seeks to give an overview of problems arising with the change to lead‐free soldering and to give guidance on possible counter actions in the context of the chemical…

Lead/halogen‐free laminates and their effect on desmearing and metallisation

This paper aims to show critical processing issues observed for the newer restriction of the use of hazardous substances compliant laminate materials.

Selection and qualification of polymers for rigid and flexible interconnect applications

This paper seeks to give an overview on the benefits and challenges of moulded interconnect devices‐technology and the use of flexible printed circuits (FPC) in electronics…

The advantages of mildly alkaline immersion silver as a final finish for solderability

This study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular…

An integrated approach to electronic waste (WEEE) recycling

This paper aims to present a review carried out under DEFRA‐funded project WRT208, describing: the composition of WEEE, current treatment technologies, emerging technologies and…

Lead-Free Defect Guide launched at Nepcon by SMART Group

EIPC Winter Conference Salzburg, 8-9 February 2007

International diary

DEK invites visitors to "expect more" at Nepcon 2007, stand B40

Lloyd Doyle announce new installation

Merlin Circuit Technology and sister Kestrel International Circuits will be exhibiting together at Nepcon

Company profile

SMART Group at Nepcon Electronics 2007 - Helping Industry Competitiveness

Ken Horgan named Strategic Accounts Manager of Valor Inc

Fixtureless testing joins the ScanINSPECT family

Polymers in electronics

Looking to break into the defence industry?

University of Glasgow James Watt Nanofabrication Centre officially opened

Aspocomp says could close Salo plant

Editorial

Graphic PLC debuts enhanced reliability of new copper fill line at Nepcon 2007

Itochu introduces its rent to buy option for test and inspection equipment at Nepcon 2007

Mania Technologie AG has appointed Dr Jan Lipton as the new Chief Executive Officer

NPL's Chris Hunt awarded Honourable Mention Paper at APEX