Indium Corporation of America announces solder paste price increase

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2001

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Keywords

Citation

(2001), "Indium Corporation of America announces solder paste price increase", Soldering & Surface Mount Technology, Vol. 13 No. 3. https://doi.org/10.1108/ssmt.2001.21913cab.021

Publisher

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Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


Indium Corporation of America announces solder paste price increase

Indium Corporation of America announces solder paste price increase

Keyword: Solder paste

Indium Corporation of America has raised solder paste prices from 30 June 2001. The pricing plan calls for an increase of 12-15 per cent across all paste product lines.

"As a supplier to Electronic Manufacturing Service providers (EMS), we have experienced a significant and steady decline in solder paste prices without regard to the material's positive impact on bottom line costs. While some suppliers curtail funding for critical R&D and technical support programs, we continue investing in the ability to offer our customers increased productivity and enhanced manufacturing performance by leveraging these vital functions", said Charles Less, Indium Corporation's Vice President of Marketing.

For the latest product pricing information, please contact (315) 853 4900.

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