Keywords
Citation
(2000), "MRSI 175 ENCore encapsulation system captures vision award", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bab.024
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
MRSI 175 ENCore encapsulation system captures vision award
Keywords MRSI, Encapsulation, Awards
MRSI was awarded the coveted Vision Award in its category - "Best new product - dispense equipment for advanced packaging technology" - for its MRSI 175 ENCore Encapsulation System. The award was presented at a special ceremony at the APEX Conference and Exhibition in Long Beach, California on 13 March 2000. The Vision Awards competition recognizes significant advances in electronics packaging, materials, and assembly technology. Receiving the award for MRSI were Daniel Crowley, vice president, sales, and Prasad Nevrekar, director of sales and marketing for dispense product lines.
The heart of the MRSI-175 Encore is the patent pending Dual Chamber Linear Positive Displacement (LPD) Pump designed and built at MRSI. It is used where high accuracy and high speed point-of-use material delivery is required for applications such as IC encapsulation (BGA dam and fill, COB glob top and underfill). The uniquely designed dual chambers allow material to be dispensed continuously when required. In other words, dispensing and recharging occurs simultaneously - when one chamber is dispensing, the other is recharging. This process alternates between chambers resulting in "zero refill time".
In addition, parallel processing substrate conveyors keep the process going continuously as the substrate is being pre-heated on one conveyor, material is being dispensed on the other. The result is significantly higher throughput and improved productivity. Other features such as vision alignment, z-height sensing, heated dispense needle, Windows NT software, and calibration scale, all provide the best process control for uninterrupted production.