Keywords
Citation
(2003), "Probe needles for wafer and hybrid test applications", Microelectronics International, Vol. 20 No. 2. https://doi.org/10.1108/mi.2003.21820bad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Probe needles for wafer and hybrid test applications
Probe needles for wafer and hybrid test applications
Keywords: Probes, Needle
Designed for use in wafer and hybrid test applications, the ATEK Technology range of probe needles offers high electrical conductivity and flexural strength as well as corrosion and wear resistance.
Featuring a nickel plated finish, they are made from tungsten or tungsten-rhenium to provide the required hardness for a precise contact onto aluminium pads. Even after many cycles, these rugged, reliable needles exhibit minimum tip wear and offer a longer service life. In addition they afford greater penetration into the oxide coating of aluminium pads during contacting.
The ATEK range comprises needle diameters from 7 to 14 mm in lengths from 1,250 to 2,000 mm, with taper lengths and round tip diameters from 80 to 150 mm and 1.0 to 8.0 mm. Tip drops are available from 7 to 220 mm and tip angles from 61 to 83°. Straight needles, flat tips and other materials, including BeCu and Trivar, can also be supplied.
For more information, visit our Web site: www.atek.com