IMAPS USA

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999

34

Keywords

Citation

(1999), "IMAPS USA", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.007

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


IMAPS USA

IMAPS USA

KeywordsIMAPS, USA

Future communication networks ­ trends and tradeoffs MMRC workshop

The Microelectronics Marketing Research Council (MMRC), an IMAPS sponsored organization, will meet in Baltimore, MD, 21-23 June 1999. The MMRC Workshop theme is "Future communication networks ­ trends and tradeoffs (twisted pair, co-ax cable, fiber optic, satellite, wireless).

"The communications industry is literally changing our world and the way we live at breakneck speed. Today, with less than 50 per cent of the world's population having access to telephone service, and the rest of us demanding higher and higher bandwidth on demand, the communications infrastructure industry has its work cut out for it.

"What are the trends and tradeoffs for the various means of bringing communications to the world's population, in the next ten to 20 years? Who is/is not expected to make money in the future? How will these trends and tradeoffs affect the microelectronics and packaging industry? What are the expected and desired developments needed to meet these needs?

"By bringing together numerous industry leaders at many levels of the supply chain, the MMRC will cover these and other topics in this groundbreaking, International, Microelectronics Marketing Research Council Workshop", stated Don Brown, director of the International Wireless Packaging Consortium and program chair for the MMRC Workshop.

Sessions include: "Overview of network and switching systems", "Panel session ­ trends and tradeoffs in various network technologies and topologies", "Packaging issues session", and the MMRC trademarked "Wall Street session".

For more information, visit our home page http://www.imaps.org

Cook outlines IMAPS vision for 1999

In his inaugural speech to the IMAPS membership, James T. Cook, 1999 President of the International MicroElectronics and Packaging Society, outlined his vision for the next year and the future of the society.

"As a professional society, IMAPS needs to keep current with membership needs and emerging technologies", stated Cook, "my plan for the upcoming year will address these needs in the following ways:

  • Headquarters will provide a more focused approach to supporting our North American chapters. This will include providing program management assistance to regional activities such as chapter symposiums, and vendors' night programs. We have laid the foundation with joint activities being scheduled with SMTA.

  • The marketing department will provide assistance in recruiting and servicing of our individual and organizational members. Also, we will actively pursue the development of new student chapters.

  • In keeping with our focus of total customer service and providing more accessibility of training materials to our membership, we will expand our efforts in using distance learning and online instruction methods to bring the instruction to members. We will continue our efforts to move more documentation and sessions to an electronic format.

  • Our technical committee will provide speakers if available for those regional activities.

  • We will continue to sustain our support of our international chapters.

  • In order to provide a smoother transition and visibility for the future of IMAPS, a three-year strategic plan has been developed. This plan will be the foundation to provide the financial planning for activities and alliances that will benefit the society."

President Cook announced this vision at the IMAPS Membership Meeting and Luncheon, 2 November 1998, at IMAPS '98 the 31st International MicroElectronics Symposium at the San Diego Convention Center.

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