The Concept and Success of No‐clean Technology

Abstract

No‐clean fluxes and solder pastes are rapidly finding an important position in soldering production technology. Their growth has been strongly influenced by the increasingly large usage of surface mount components, and accelerated by the need for an alternative to cleaning procedures which incorporate CFCs. The ‘no‐clean’ concept is not new, but the very low residue levels now attainable have added an important new dimension in formulation and inspection technologies.

Citation

Rubin, W. (1995), "The Concept and Success of No‐clean Technology", Circuit World, Vol. 21 No. 2, pp. 23-27. https://doi.org/10.1108/eb046301