Reliability of Surface Mount Electronics Assemblies Cleaned Using CFC‐113‐free Techniques

Abstract

This paper summarises briefly all the substitutive techniques for CFC‐113 and 1,1,1 ‐trichloroethane blend cleaning, including the use of ‘no‐clean’ and controlled atmosphere soldering, with emphasis on high‐reliability applications. Each technique is discussed with regard to its influence on the final reliability of the assembly under normal and abnormal storage and working conditions. Reliability is determined by numerous other parameters which are frequently ignored, such as the component layout for best cleaning quality. The requirements of conformal coating are also frequently given scant attention. In practical terms, this paper may help those selecting a substitutive soldering/cleaning process to choose one which will meet their quality requirements at minimum cost.

Citation

Ellis, B.N. (1992), "Reliability of Surface Mount Electronics Assemblies Cleaned Using CFC‐113‐free Techniques", Circuit World, Vol. 19 No. 1, pp. 6-13. https://doi.org/10.1108/eb046185