Fine Line Conductor Formation

Abstract

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.

Citation

Nakahara, H. (1992), "Fine Line Conductor Formation", Circuit World, Vol. 18 No. 2, pp. 42-46. https://doi.org/10.1108/eb046158