Non‐conventional Substrates

Abstract

This paper describes recent printed board applications in circuit manufacturing on novel non‐laminate substrates. It specifically discusses properties pertinent to metal core, thermal plastics, and new processing conditions for circuitising the new substrates. Techniques explored are intended to provide rigidity, flatness, dimensional stability and improved thermal management.

Citation

Messner, G. (1985), "Non‐conventional Substrates", Circuit World, Vol. 11 No. 2, pp. 39-41. https://doi.org/10.1108/eb045990