A Method for Scanning Electron Microscope Analysis of Laser Drilled Thick Film Vias
J.J. Barrett
(National Microelectronics Research Centre, University College, Cork, Ireland)
P.L. Moran
(National Microelectronics Research Centre, University College, Cork, Ireland)
23
Abstract
In order to evaluate laser drilled vias in thick film dielectric materials a method of sectioning twenty micron vias has been developed. The value of the sections is illustrated by comparing vias in various dielectric materials.
Citation
Barrett, J.J. and Moran, P.L. (1984), "A Method for Scanning Electron Microscope Analysis of Laser Drilled Thick Film Vias", Microelectronics International, Vol. 1 No. 4, pp. 61-63. https://doi.org/10.1108/eb044145
Publisher
:MCB UP Ltd
Copyright © 1984, MCB UP Limited