Relationship of Corner Cracking in Multilayer Board Holes to Pyrophosphate Copper Plate
D.E. Sherlin
(Hughes Aircraft Co., Fullerton, California)
L.K. Bjelland
(Hughes Aircraft Co., Fullerton, California)
35
Abstract
In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the authors discuss the problem of corner cracking in multilayer boards in relation to the electrodeposition of copper from the pyrophosphate electrolyte.
Citation
Sherlin, D.E. and Bjelland, L.K. (1977), "Relationship of Corner Cracking in Multilayer Board Holes to Pyrophosphate Copper Plate", Circuit World, Vol. 4 No. 1, pp. 22-24. https://doi.org/10.1108/eb043569
Publisher
:MCB UP Ltd
Copyright © 1977, MCB UP Limited