Lead‐free Solder Pastes Evaluation at Motorola Transmission Products Division

Abstract

The increased interest in the electronics industry to search for alternatives to lead‐containing solders is evidenced by the number of recently published articles on lead‐free solders in this journal and other journals. At the latest Surface Mount International conference, several papers were presented on lead‐free solder alloys, conductive adhesives and organic preservatives, all in search of replacements for lead‐containing finishes. The efforts to find a replacement for tin/lead are in response to possible legislation banning lead or possible taxation on the use of lead. In an attempt to reduce the use of lead in this company's assembly operation, five lead‐free solder pastes and four corresponding flux vehicles (for A, B, C and E pastes) were evaluated. All of the flux vehicles passed the standard industry tests except for two flux vehicles (pastes B and C) that failed the copper mirror test. An assembly trial of the lead‐free pastes was carried out by building liquid crystal display panels with minimal process modification. Printability, process compatibility and solder joint reliability were assessed. This paper describes the preliminary results of the authors' investigation.

Citation

Akinade, K., Burgess, R., Campbell, M., Carver, S., Sanderson, L., Wade, R. and Melton, C. (1995), "Lead‐free Solder Pastes Evaluation at Motorola Transmission Products Division", Soldering & Surface Mount Technology, Vol. 7 No. 2, pp. 50-54. https://doi.org/10.1108/eb037897