Lead‐free solders — The next environmental challenge?

Abstract

The electronics assembly industry has experienced many changes in recent years and continues to meet new challenges on technical, economic and environmental fronts. Throughout its history, however, one aspect of assembly has remained constant — the joining medium. Tin‐lead alloys have been used for joining at least since Roman times, and not without good reason. Their excellent soldering efficiency, proven reliability and relatively low cost have meant that tin‐lead solders have remained unchallenged as the industry standard. This situation, however, is coming under increasing threat from the ‘green’ lobby.

Citation

WHITMORE, M. (1993), "Lead‐free solders — The next environmental challenge?", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 2-2. https://doi.org/10.1108/eb037833