A Thermoanalytical Study of the Components and Formulation of a Rosin Based Flux
K. Sherman
(Microelectronics and Computer Technology Corporation, Austin, Texas, USA)
C.A. MacKay
(Microelectronics and Computer Technology Corporation, Austin, Texas, USA)
55
Abstract
Thermoanalytical spectra of the components of a typical rosin based flux and the interactions of the components with each other, the substrate and the solder are presented. The study includes heating rates up to those experienced in typical soldering operations.
Citation
Sherman, K. and MacKay, C.A. (1990), "A Thermoanalytical Study of the Components and Formulation of a Rosin Based Flux", Soldering & Surface Mount Technology, Vol. 2 No. 3, pp. 28-31. https://doi.org/10.1108/eb037731
Publisher
:MCB UP Ltd
Copyright © 1990, MCB UP Limited