Keywords
Citation
(2005), "Enthone introduces STANNOSTAR® 1405", Circuit World, Vol. 31 No. 1. https://doi.org/10.1108/cw.2005.21731aad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
Enthone introduces STANNOSTAR® 1405
Enthone introduces STANNOSTAR® 1405
Bright, high speed, pure tin electroplating process
Keywords: Tin-lead, Electroplating
Enthone, Inc. has introduced STANNOSTAR 1405 bright, high-speed, pure tin electroplating process. STANNOSTAR 1405 delivers lead-free deposits that exhibit excellent brightness and solderability over the widest current density and temperature ranges of any process on the market today.
Ideally suited for connectors and other microelectronics applications, the lead-free component finish addresses tin whisker formation, solderability failures and other reliability issues. STANNOSTAR 1405 may be used to produce bright deposits with minimum organic inclusion.
STANNOSTAR 1405 features a two- component additive package, providing ease of bath control and consistent, stable deposit morphology. It has a low-carbon content and offers 90 percent efficiency, resulting in increased throughput and efficient operation.