Embedded passives conference at National Physical Laboratory

Citation

(2005), "Embedded passives conference at National Physical Laboratory", Circuit World, Vol. 31 No. 1. https://doi.org/10.1108/cw.2005.21731aac.004

Embedded passives conference at National Physical Laboratory

Embedded passives conference at National Physical Laboratory

Keywords: Embedded passives, Conferences

Speaker: Dr Richard Ulrich, University of Arkansas, The High Density Electronics Centre

To be held at the National Physical Laboratory Conference Centre, Module 16, Queens Road, Teddington, TW11 0LW

If you are involved in electronics packaging, circuit board manufacture, electrical design and passive component technologies, this will be of interest.

Registration from 0900. Morning Session 9.30 to 12.00Lunch 12.00 to 13.00Afternoon Session 13.00 to 16.30

Dr Rick Ulrich (Plate 9) is a Professor of Chemical Engineering at the University of Arkansas. His research areas are centred on the materials aspects of HDI packaging, particularly embedded passives. He is the lead author of “Integrated Passive Component Technology”, published by Wiley Press, the first book dedicated to this topic. He is a member of the National Electronics Manufacturer's Institute (NEMI) Committee on Future Technologies, Passive Components group, a columnist for CircuiTree magazine, and an Associate Editor for IEEE.

Plate 9 Dr Richard Ulrich will be speaking at the Embedded Passives Conference

Participants must pre-register and pre-pay.

Registration fee

£280 + £49 VAT= £329 per person.Lunch and refreshments provided.Registrations after September 1st 2004 are charged at £320 + £56 VAT= £376There is a 20 percent discount for SSTC members.

Description

This course will be a comprehensive review of potential applications, commercialised technology, and possible future directions in embedded passive components and processing for organic boards. The organization of the course centres on the benefits and problems with their implementation in order to help potential users make decisions about their applicability in a given situation. Considerable time will also be spent on the candidate materials and processes for embedded resistors, capacitors and inductors in order to help the potential user decide what processes can provide the needed electrical performance while being compatible with their existing substrates and fabrication technology.

Emphasis will also be placed on electrical testing, since users of embedded passives will find themselves in the business of producing passive components, not just buying them, and since the electrical performance characteristics of embedded passives can be very different from their surface- mount counterparts, possibly providing significant competitive advantages. Several current potential applications will be described, with particular emphasis on decoupling.

The course emphasizes applicability to manufactured microelectronic systems and includes theoretical material necessary to support that purpose.

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