Keywords
Citation
(1999), "Microvia technology hot topic for IPC Printed Circuits Expo '99", Circuit World, Vol. 25 No. 1. https://doi.org/10.1108/cw.1999.21725aac.002
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Microvia technology hot topic for IPC Printed Circuits Expo '99
Microvia technology hot topic for IPC Printed Circuits Expo '99
Keywords IPC, Market trends, Microvias
The global market for microvia boards is expected to reach $7.7 billion by 2007. To help the industry prepare, educational programming at IPC Printed Circuits Expo '99 will focus on critical aspects of this technology. The IPC Printed Circuits Expo '99 will be held on 14-18 March 1999, at the Long Beach Convention Center in Long Beach, California.
"It is estimated that there will be a tenfold increase in production of microvia PWBs over the next five years", says IPC Educational Director John Riley. "But just as important will be the 'spin-off' technologies for creating finer lines and spaces and smaller holes that will influence conventional PWB manufacturing".
Attendees can choose from six half-day workshops and full-day tutorials that will explore the various issues surrounding the production of high density, microvia printed boards. The following full-day tutorials will be held on Sunday, 14 March 1999, from 8.30 a.m. to 4 p.m.:
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Microvias: understanding laser and other small hole technologies.
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The Microvia Opportunity: technology, markets and applications
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Microvia and High Density Interconnect: material selection, fabrication processes, and design guidelines
The following half-day workshops will be held on Monday 15 March:
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High Density Base Material Alternatives, Parts I and II.
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Testing HDI/Emerging Packaging Bareboards.
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Pitfalls and Roadblocks to the Implementation of Microvia Technology.
The programme places a stronger emphasis on laser direct imaging (LDI) at this year's event. Both a tutorial and workshop will be held to address LDI issues. In the tutorial session, "Direct Write Exposure Techniques for PCB Imaging: the History and Future", Jeffrey Rittichier from ETEC Systems will try to impart to attendees a working knowledge of the latest developments in LDI, while teaching them how to evaluate this technology for their own facilities. An analysis of cycle times, resist photosensitivity, and data rate limits will also be included, as well as a discussion of LDI yield improvements for fine line imaging.
At a half-day workshop, Michael Carano, from Electrochemicals, will provide a thorough understanding of the reliability issues associated with the metallisation of plated through-hole PWBs. Carano says it is important for fabricators, assemblers and end-users to understand the technological shift in metallising through-hole PWBs utilising direct metallisation processes in place of conventional electroless copper technology.
More than 35 other tutorials and workshops are scheduled for the two-day educational seminar, at IPC Printed Circuits Expo '99. For more information on the educational sessions being offered, Tel: John Riley, (847) 790-5308; or E-mail: JohnRiley@ ipc.org. For more information on IPC Printed Circuits Expo, Tel: +1 (847) 509-9700.