Keywords
Citation
(1999), "ITRI and NCMS win national award", Circuit World, Vol. 25 No. 1. https://doi.org/10.1108/cw.1999.21725aab.009
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
ITRI and NCMS win national award
ITRI and NCMS win national award
Keywords Awards, ITRI
The Interconnection Technology Research Institute (ITRI), in collaboration with the National Center for Manufacturing Sciences (NCMS), the National Electronics Manufacturing Initiative (NEMI) and a dozen industry partners, has won a National Institute of Standards and Technology (NIST) Advanced Technology Program Award.
In addition to ITRI, NCMS and NEMI, other team members on the Advanced Embedded Passives Technology Consortium are: 3M, Compaq Computer, Delphi Delco Electronics, Du Pont Photopolymer and Electronic Materials, Du Pont High Performance Films, IBM, HADCO Corporation, MacDermid, Merix Corporation (Nasdaq: MERX news), Northern Telcom, Nu Thena Systems and ORMET Corporation.
The NIST award will cover half the costs of the $16.1 million project the group is undertaking to develop the materials, design and processing technology needed for embedding passive devices on to circuit board substrates. Consortium members on this programme will develop the technology and manufacturing expertise needed to:
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Meet the needs of the microelectronics industry for compact, high-performance products that incorporate proven embedded passives technology.
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Lower system costs.
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Develop optimum pathways for commercialisation of the technology created in the project.
ITRI will lead the commercialisation segment of the project. "The success of an embedded circuit (and the programme) is based on how widespread its use is, and that is why ITRI's role in the project is so important," says ITRI chief executive officer Marshall Andrews.
Passive devices account for up to 90 per cent of the component placements required in the manufacturing process and take up to 40 per cent of the space on PWBs. Embedding these devices into the PWB will increase product density, which will, in turn, enable smaller size, greater performance and higher speeds. At the same time, the board assembly manufacturing process will be simplified.
For more information on the Advanced Embedded Passives Technology Consortium, contact Marshall Andrews., Tel: +1 (512) 833-9930; or E-mail: yoda@pipeline.com