Osprey Metals becomes Sandvik Osprey

Aircraft Engineering and Aerospace Technology

ISSN: 0002-2667

Article publication date: 1 June 2005

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Keywords

Citation

(2005), "Osprey Metals becomes Sandvik Osprey", Aircraft Engineering and Aerospace Technology, Vol. 77 No. 3. https://doi.org/10.1108/aeat.2005.12777cad.002

Publisher

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Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited


Osprey Metals becomes Sandvik Osprey

Osprey Metals becomes Sandvik Osprey

Keywords: Alloys, Sandvik Osprey

To reinforce its commitment to activities in the field of controlled expansion alloys, Sandvik Materials Technology has recently changed the name of its subsidiary Osprey Metals to “Sandvik Osprey”. Originally formed in 1974, Osprey Metals has been a member of the Sandvik Group for almost 25 years.

Says Nigel Haworth, a Sandvik Ltd and Sandvik Osprey Director, “The Osprey Controlled Expansion (CE) Alloys fit extremely well into the Sandvik Materials Technology philosophy of promoting materials with high demands on properties and where the associated development of products requires close cooperation with key customers”.

Sandvik Osprey sells its range of ultra-lightweight, silicon-aluminium, controlled expansion alloys in the form of machined and electroplated carriers, housings, packages, including hermetic packages, and structural components. For many applications, the alloys offer a lower cost option to materials such as Cu/W, Cu/Mo, AlSiC, or Be alloys. At the same time, they provide extremely attractive properties in terms of thermal conductivity, specific stiffness and density compared, for example, to alloys such as titanium or kovar.

Applications for which CE alloys are currently being used or qualified include: microwave housings for ground-based/airborne radar, aircraft and satellite systems; optical packages for use in imaging systems; guide bars on printed circuit boards for use in embedded computer products; carrier plates for advanced sensor devices; backing plates for cladding to conventional circuit board materials; lightweight, structural, stiff components for use in rapidly moving parts, e.g. for use in anti-missile, missile defence systems or linear motors in the semi-conductor processing industry; assembly fixtures for the use in the fabrication of microprocessors.

Details available from: Sandvik Osprey Ltd, Tel: +44 1639 634121; Fax: +44 1639 630100; E-mail: ceallovs.osprev@sandvik.com

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