Keywords
Citation
(2002), "New thin bondline, thermal interface material – low thermal resistance with high integrity", Assembly Automation, Vol. 22 No. 1. https://doi.org/10.1108/aa.2002.03322aad.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New thin bondline, thermal interface material – low thermal resistance with high integrity
New thin bondline, thermal interface material – low thermal resistance with high integrity
Keywords: Semiconductors, Assembly, Heat
New from INTERTRONICS is an innovative thermal interface material.
Thermoset Gelease™ -MG-121 combines the extremely low thermal resistance properties of a grease with the integrity of a gel.
Gelease-MG-121 can be used in cross- sectional thickness as low as 1-2 thou in order to minimise the thermal pathway and maximise heat flow. It offers the same thermal performance as a high performance grease while minimising the possibility of bleed, separation and "pump-out" (Plate 9).
Plate 9
Gelease-MG-121 is designed for applications such as flip chip to thermal plate, BGA to heatsink and PGA to heatsink. The new product exhibits excellent flow properties and dispenses easier than most thermal greases. A short, low temperature oven cure or the operating temperature of the processor itself will allow the material to gel to its final integral state.
The material's thermal resistance is 0.06-0.07°C in2/W. It has a low Modulus of Elasticity (3.5 × 105Pa) and a very low Glass Transition Temperature ( 121°C).
Full details at www.intertronics.co.uk or from INTERTRONICS on UK 01865 842842.