Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Abstract

Purpose

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

Design/methodology/approach

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

Findings

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

Originality/value

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

Citation

Gharaibeh, M.A., Feisst, M. and Wilde, J. (2024), "Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing", Soldering & Surface Mount Technology, Vol. 36 No. 2, pp. 132-143. https://doi.org/10.1108/SSMT-10-2023-0061