Electrodeposition of thin metallic layer for solar cell electrodes
Abstract
Purpose
The paper aims to show application of the electrochemically deposited coatings for thickening of the screen printed electric paths potentially applied in photovoltaic cells.
Design/methodology/approach
The electric paths were screen printed with the use of silver-based paste. The paths were thickened by electrodeposition of thin copper layer in potentiostatic regime from surfactant-free plating bath. The morphology and surface quality of the paths were studied by imaging with scanning electron microscopy.
Findings
The electric paths can be thickened successfully, but quality for the screen printed substrate determines quality of deposited layer. The EDX analysis confirmed that the deposited copper layer covered uniformly the printed paths.
Research limitations/implications
The adhesion of the copper-covered path to the silicon wafer surface depends on adhesion of the original screen printed path.
Originality/value
This paper confirms that electrodeposited copper can be applied for screen printed silver paths thickening in a controllable way.
Keywords
Acknowledgements
This work was supported under Development Project No. NR10-0020-10/2011.
Citation
Drabczyk, K., Socha, R., Panek, P. and Mordarski, G. (2014), "Electrodeposition of thin metallic layer for solar cell electrodes", Soldering & Surface Mount Technology, Vol. 26 No. 1, pp. 18-21. https://doi.org/10.1108/SSMT-10-2013-0032
Publisher
:Emerald Group Publishing Limited
Copyright © 2014, Emerald Group Publishing Limited