Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 6 September 2019
Issue publication date: 17 January 2020
Abstract
Purpose
This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere.
Design/methodology/approach
In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere.
Findings
In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C.
Originality/value
This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.
Keywords
Acknowledgements
This study is supported by the project number 117M083 by TUBITAK 3001 Initiative Research and Development Project Support Program.
Citation
Erer, A.M. and Oguz, S. (2020), "Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems", Soldering & Surface Mount Technology, Vol. 32 No. 1, pp. 19-23. https://doi.org/10.1108/SSMT-08-2018-0028
Publisher
:Emerald Publishing Limited
Copyright © 2019, Emerald Publishing Limited