Cu3Sn-microporous copper composite joint for high-temperature die-attach applications
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 4 October 2021
Issue publication date: 12 April 2022
Abstract
Purpose
The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.
Design/methodology/approach
The composite joint was made of microporous copper and Cu3Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa.
Findings
After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu3Sn with high remelting temperatures. A large shear strength could be achieved with the Cu3Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C.
Originality/value
This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.
Keywords
Citation
Pan, Z. and Sun, F. (2022), "Cu3Sn-microporous copper composite joint for high-temperature die-attach applications", Soldering & Surface Mount Technology, Vol. 34 No. 3, pp. 137-144. https://doi.org/10.1108/SSMT-07-2021-0047
Publisher
:Emerald Publishing Limited
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