A review: effect of copper percentage solder alloy after laser soldering
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 1 December 2022
Issue publication date: 21 April 2023
Abstract
Purpose
This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.
Design/methodology/approach
This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.
Findings
This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability.
Research limitations/implications
This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC.
Originality/value
The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.
Keywords
Acknowledgements
The authors would like to thank for the financial support for this work from FRGS/1/2018/TK03/UMP/02/21 (RDU190152) by Ministry of Higher Education for providing the research facilities.
Citation
Abdullah, A. and Aisha Idris, S.R. (2023), "A review: effect of copper percentage solder alloy after laser soldering", Soldering & Surface Mount Technology, Vol. 35 No. 3, pp. 175-188. https://doi.org/10.1108/SSMT-03-2022-0022
Publisher
:Emerald Publishing Limited
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