Defect patterns study of pick-and-place machine using automated optical inspection data
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 4 August 2021
Issue publication date: 17 February 2022
Abstract
Purpose
This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning.
Design/methodology/approach
This study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result.
Findings
The experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods.
Practical implications
This study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production.
Originality/value
The findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.
Keywords
Acknowledgements
The authors would like to thank S. Park, S. W. Yoon, and D. Lee for their support, valuable discussions, and insights into this research. The reviewers and colleagues are also appreciated for their useful comments to improve this article.
Citation
Cen, Y., He, J. and Won, D. (2022), "Defect patterns study of pick-and-place machine using automated optical inspection data", Soldering & Surface Mount Technology, Vol. 34 No. 2, pp. 69-78. https://doi.org/10.1108/SSMT-03-2021-0007
Publisher
:Emerald Publishing Limited
Copyright © 2021, Emerald Publishing Limited