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Multi-pass path planning for thick plate by DSAW based on vision sensor

Chengdong Yang (School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China)
Zhen Ye (School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China)
Yuxi Chen (School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China)
Jiyong Zhong (School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China)
Shanben Chen (School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China)

Sensor Review

ISSN: 0260-2288

Article publication date: 26 August 2014

376

Abstract

Purpose

This paper aims to solve the problem that the changing of groove size and assembly gap would affect the precision of the multi-pass path planning and the welding quality and realize the automatic welding of a thick plate.

Design/methodology/approach

First, a double-sided double arc welding (DSAW) system with a self-designed passive vision sensor was established, then the image of the groove was captured and the characteristic parameters of groove were extracted by image processing. According to the welding parameters and the extracted geometry size, multi-pass path planning was executed by the DSAW system.

Findings

A DSAW system with a self-designed passive vision sensor was established which can realize the welding thick plate by double-sided double arc by two robots. The clear welding image of the groove was acquired, and an available image processing algorithm was proposed to accurately extract the characteristic parameters of the groove. According to the welding parameters and the extracted geometry size, multi-pass path planning can be executed by the DSAW system automatically.

Originality/value

Gas metal arc welding is used for root welding and filler passes in DSAW. Multi-pass path planning for thick plate by Double-sided Double Arc Welding (DSAW) based on vision sensor was proposed.

Keywords

Acknowledgements

This work is supported by the National Natural Science Foundation of China under the Grant No. 51105252. Shanghai Sciences & Technology Committee under Grant No. 11111100300, Shanghai, P. R. China.

Citation

Yang, C., Ye, Z., Chen, Y., Zhong, J. and Chen, S. (2014), "Multi-pass path planning for thick plate by DSAW based on vision sensor", Sensor Review, Vol. 34 No. 4, pp. 416-423. https://doi.org/10.1108/SR-04-2013-649

Publisher

:

Emerald Group Publishing Limited

Copyright © 2014, Emerald Group Publishing Limited

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