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Experimental verification of computational and sensitivity analysis on substrate deformation and plastic strain induced by hollow thin-walled WAAM structure

Keval P. Prajadhiana (UiTM Puncak Alam, Selangor, Malaysia)
Yupiter H.P. Manurung (UiTM Puncak Alam, Selangor, Malaysia)
Alexander Bauer (TU Chemnitz Chemnitz Germany)
Mohd Shahriman Adenan (UiTM Puncak Alam, Selangor, Malaysia)
Nur Izan Syahriah (Universiti Teknikal Malaysia Melaka Hang Tuah Jaya, Melaka Malaysia)
Mohamed Ackiel Mohamed (Serba Dinamik Group Berhad Shah Alam Malaysia)
Birgit Awiszus (TU Chemnitz Chemnitz Germany)
Marcel Graf (TU Chemnitz Chemnitz Germany)
Andre Haelsig (TU Chemnitz Chemnitz Germany)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 11 October 2021

Issue publication date: 18 March 2022

293

Abstract

Purpose

This paper aims to numerical and experimental analysis on substrate deformation and plastic strain induced by wire arc additive manufacturing.

Design/methodology/approach

The component has the form of a hollow, rectangular thin wall consisting of 25 deposition layers of SS316L on an SS304 substrate plate. Thermo-mechanical finite element analysis was applied with Goldak’s double-ellipsoidal heat-source model and a non-linear isotropic hardening rule based on von Mises’ yield criterion. The layer deposition was modelled using simplified geometry to minimize overall pre-processing work and computational time.

Findings

A new material modelling of SS316L was obtained from the chemical composition of the evolved component characterized by scanning electron microscope/energy dispersive X-ray and further generated by an advanced material-modelling software JMatPro. In defining heat-transfer coefficients, transient thermometric analysis was first performed in the bead and on the substrate, which was followed by an adjustment of the heat-transfer coefficients to reflect the actual temperature distribution. Based on the adjusted model and boundary conditions, sensitivity analysis was conducted prior to the ultimate simulation of substrate deformation and equivalent plastic strain. Furthermore, this simulation was verified by conducting a series of automated wire + arc additive manufacturing tests using robotic gas Metal arc welding with distortion measured by coordinate-measurement machine and equivalent plastic strain measured by optical three-dimensional-metrology measurements (Gesellschaft für Optische Messtechnik).

Originality/value

It can be concluded that a proper numerical computation using the adjusted model and property-evolved material exhibits a similar trend with acceptable agreement compared to the experiment by yielding an error percentage up to 30% for deformation and up to 21% for equivalent plastic strain at each individual measurement point.

Keywords

Acknowledgements

The authors would like to express their gratitude to a staff member of Smart Manufacturing Research Institute (SMRI), as well as staff of Welding Laboratory, Advanced Manufacturing Laboratory, Advanced Manufacturing Technology Excellence Centre (AMTEx) and Research Interest Group: Advanced Manufacturing Technology (RIG: AMT) at Faculty of Mechanical Engineering, Universiti Teknologi MARA (UiTM), Professorship of Virtual Production Engineering and Chair of Welding Engineering at Chemnitz University of Technology (CUT) in Germany for encouraging this research. This research is financially supported by DAAD Germany (Future Technology Additive Manufacturing) with Project Code: 57525437, Geran Penyelidikan Khas (GPK) with Project Code: 600-RMC/GPK 5/3 (123/2020) and Geran Konsortium Kecemerlangan Penyelidikan (Large Volume Additive Manufacturing/LVAM) from Ministry of Higher Education (MOHE) in Malaysia.

Citation

Prajadhiana, K.P., Manurung, Y.H.P., Bauer, A., Adenan, M.S., Syahriah, N.I., Mohamed, M.A., Awiszus, B., Graf, M. and Haelsig, A. (2022), "Experimental verification of computational and sensitivity analysis on substrate deformation and plastic strain induced by hollow thin-walled WAAM structure", Rapid Prototyping Journal, Vol. 28 No. 3, pp. 559-572. https://doi.org/10.1108/RPJ-06-2020-0135

Publisher

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Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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