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Thermal management of square light emitting diode arrays: modeling and parametric analysis

Mohamed Bechir Ben Hamida (Department of Chemical Engineering, College of Engineering, Imam Mohammad Ibn Saud Islamic University (IMSIU), Riyadh, Saudi Arabia) (Research Laboratory of Ionized Backgrounds and Reagents Studies (EMIR), Preparatory Institute for Engineering Studies of Monastir (IPEIM), University of Monastir, Monastir, Tunisia) (Higher School of Sciences and Technology of Hammam Sousse (ESSTHS), University of Sousse, Sousse, Tunisia)

Multidiscipline Modeling in Materials and Structures

ISSN: 1573-6105

Article publication date: 21 February 2024

Issue publication date: 8 March 2024

74

Abstract

Purpose

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

Design/methodology/approach

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Findings

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

Originality/value

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

Keywords

Citation

Ben Hamida, M.B. (2024), "Thermal management of square light emitting diode arrays: modeling and parametric analysis", Multidiscipline Modeling in Materials and Structures, Vol. 20 No. 2, pp. 363-383. https://doi.org/10.1108/MMMS-09-2023-0311

Publisher

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Emerald Publishing Limited

Copyright © 2024, Emerald Publishing Limited

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