Temperature effects in the analysis of electromechanical impedance by using spectral element method
Multidiscipline Modeling in Materials and Structures
ISSN: 1573-6105
Article publication date: 13 June 2016
Abstract
Purpose
The purpose of this paper is to develop a spectral element modeling to predict electromechanical admittance in the surface-bonded piezoelectric wafer and beam structure considering temperature effects.
Design/methodology/approach
For modeling the beam, the axial and transverse vibrations of the beam have been considered, and temperature-dependent mechanical and electromechanical properties of piezoelectric wafer active sensor and aluminum have been analyzed. The influences of temperature effects on electromechanical admittance are investigated.
Findings
The results show that a frequency left shift and a decrease in amplitude of admittance in any natural frequencies with increasing temperature have been observed. The mechanism of these changes is discussed.
Originality/value
The numerical results may be considered helpful for structural health monitoring using electromechanical impedance technique.
Keywords
Acknowledgements
This research was supported by the National Natural Science Foundation of China (No. 11172114), Key Science Research Project of Jiangsu Province (No. BE2015138), the Six Talents Peak Foundation of Jiangsu Province (No. 2012-ZBZZ-027), the National Natural Science Foundation of China of the Key International Cooperation Project (No. 11520101001) and the Research Innovation Program for College Graduates of Jiangsu Province (Nos KYLX15_1045, KYLX15_1046)
Citation
Xu, G., Xu, B., Xu, C. and Luo, Y. (2016), "Temperature effects in the analysis of electromechanical impedance by using spectral element method", Multidiscipline Modeling in Materials and Structures, Vol. 12 No. 1, pp. 119-132. https://doi.org/10.1108/MMMS-03-2015-0015
Publisher
:Emerald Group Publishing Limited
Copyright © 2016, Emerald Group Publishing Limited