Connection of electronic and microelectronic modules
Abstract
Purpose
The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.
Design/methodology/approach
A newly developed system with chip or cylindrical components is presented. The article describes a practical solution of connection with 0.603 and mini-metal electrode leadless face (MELF) surface mount device (SMD) resistors.
Findings
A new method of rigid solder connection for electronic modules is presented. This system is original and patented.
Practical implications
This solution is not used yet. Testing of a new system is executed now.
Originality/value
This article shows a real and original construction with chip and cylindrical chip components.
Keywords
Acknowledgements
Funding for this research work was supported through grant project of the Czech Ministry of Education, Sport, Youth for Brno University of Technology FEKT-S-11-5/96 “Research of excellent technologies for three-dimensional packaging and interconnection”.
Citation
Sandera, J. (2014), "Connection of electronic and microelectronic modules", Microelectronics International, Vol. 31 No. 2, pp. 86-89. https://doi.org/10.1108/MI-10-2013-0053
Publisher
:Emerald Group Publishing Limited
Copyright © 2014, Emerald Group Publishing Limited