Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
Microelectronics International
ISSN: 1356-5362
Article publication date: 7 March 2023
Issue publication date: 17 March 2023
Abstract
Purpose
This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints.
Design/methodology/approach
A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength.
Findings
The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu5Zn8) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu5Zn8) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface.
Originality/value
The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.
Keywords
Acknowledgements
This work was supported by the National Natural Science Foundation of China (Grant No. 61974013 and 62274020), the China Postdoctoral Science Foundation (No. 2022MD713756), the Scientific and Technological Research Program of Chongqing Municipal Education Commission (No. KJZD-K202101101), the Chongqing Research Program Basic Research Frontier Technology (No. cstc2020jcyj-msxmX0819), the University Innovation Research Group of Chongqing (No. CXQT20023), the Graduate Innovation Project of Chongqing University of Technology (No. gzlcx20223016 and gzlcx20223023), the College Students' Innovative Entrepreneurial Training (No. 2022CX001 and 2022CX016) and the 2022 Students' Scientific Research Projects of Chongqing University of Technology (No. KLA22009 and KLA22013), respectively.
Citation
Huang, T., Gan, G., Liu, C., Ma, P., Ma, Y., Tang, Z., Cheng, D., Liu, X. and Tian, K. (2023), "Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees", Microelectronics International, Vol. 40 No. 2, pp. 70-80. https://doi.org/10.1108/MI-08-2022-0154
Publisher
:Emerald Publishing Limited
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