A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration
Microelectronics International
ISSN: 1356-5362
Article publication date: 28 July 2023
Issue publication date: 15 May 2024
Abstract
Purpose
This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.
Design/methodology/approach
Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.
Findings
The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.
Originality/value
In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.
Keywords
Citation
Gharaibeh, M.A. (2024), "A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration", Microelectronics International, Vol. 41 No. 3, pp. 121-129. https://doi.org/10.1108/MI-02-2023-0014
Publisher
:Emerald Publishing Limited
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