Characterization of embedded membrane in corrugated silicon microphones for high-frequency resonance applications

Abstract

Purpose

The purpose of this paper is to propose an alternative approach to improve the performance of microelectromechanical systems (MEMSs) silicon (Si) condenser microphones in terms of operating frequency and sensitivity through the introduction of a secondary material with a contrast of mechanical properties in the corrugated membrane.

Design/methodology/approach

Finite element method from COMSOL is used to analyze the MEMS microphones performance consisting of solid mechanic, electrostatic and thermoviscous acoustic interfaces. Hence, the simulated results could described the physical mechanism of the MEMS microphones, especially in the case of microphones with complex geometry. A 2-D model was used to simplify computation by applying axis symmetry condition.

Findings

The simulation results have suggested that the operating frequency range of the microphone could be extended to be operated beyond 20 kHz in the audible frequency range. The data showed that the frequency resonance of the microphone using a corrugated Si membrane with SiC as the embedded membrane is increased up to 70 kHz compared with 63 kHz for the plane Si membrane, whereas the microphone’s sensitivity is slightly decreased to −79 from −76 dB. Furthermore, the frequency resonance of a corrugated membrane microphone could be improved from 26 to 70 kHz by embedding the SiC material. Last, the sensitivity and frequency resonance value of the microphones could be modified by adjusting the height of the embedded material.

Originality/value

Based on these theoretical results, the proposed modification highlighted the advantages of simultaneous modifications of frequency and sensitivity that could extend the applications of sound and acoustic detections in the ultrasonic spectrum with an acceptable performance compared with the typical state-of-the-art Si condenser microphones.

Citation

Auliya, R.Z., Buyong, M.R., Yeop Majlis, B., Mohd. Razip Wee, M.F. and Ooi, P.C. (2019), "Characterization of embedded membrane in corrugated silicon microphones for high-frequency resonance applications", Microelectronics International, Vol. 36 No. 4, pp. 137-142. https://doi.org/10.1108/MI-02-2019-0010