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Numerical simulation of thermal properties at Cu/Al interfaces based on hybrid model

Yunqing Tang (Laboratory of Advanced Design, Jiangsu University, Zhenjiang, China.)
Liqiang Zhang (Laboratory of Advanced Design, Jiangsu University, Zhenjiang, China.)
Haiying Yang (Laboratory of Advanced Design, Jiangsu University, Zhenjiang, China.)
Juan Guo (Laboratory of Advanced Design, Jiangsu University, Zhenjiang, China.)
Ningbo Liao (Laboratory of Advanced Design, Jiangsu University, Zhenjiang, China.)
Ping Yang (Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, Jiangsu University, Zhenjiang, China.)

Engineering Computations

ISSN: 0264-4401

Article publication date: 5 May 2015

335

Abstract

Purpose

The purpose of this paper is to investigate thermal properties at Cu/Al interfaces.

Design/methodology/approach

A hybrid (molecular dynamics-interface stress element-finite element model (MD-ISE-FE) model is constructed to describe thermal behaviors at Cu/Al interfaces. The heat transfer simulation is performed after the non-ideal Cu/Al interface is constructed by diffusion bonding.

Findings

The simulation shows that the interfacial thermal resistance is decreasing with the increase of bonding temperature; while the interfacial region thickness and interfacial thermal conductivity are increasing with similar trends when the bonding temperature is increasing. It indicates that the higher bonding temperature can improve thermal properties of the interface structure.

Originality/value

The MD-ISE-FE model proposed in this paper is computationally efficient for interfacial heat transfer problems, and could be used in investigations of other interfacial behaviors of dissimilar materials. All these are helpful for the understanding of thermal properties of wire bonding interface structures. It implies that the MD-ISE-FE multiscale modeling approach would be a potential method for design and analysis of interfacial characteristics in micro/nano assembly.

Keywords

Acknowledgements

The authors would like to acknowledge the support of National Natural Science Foundation of China (61076098), the support of China Postdoctoral Science Special Foundation (2014T70476), the support of Jiangsu Province Science Foundation for Youths (BK20130537), Innovative Foundation for Doctoral candidate of Jiangsu Province (CXZZ13_0655 and CXLX12_0622), senior talent start-up funding of Jiangsu University (13JDG020), the support of Natural Science Foundation of Gangxi Advanced Manufacturing Key Laboratory (13-051-09-013K) during the course of this work.

Citation

Tang, Y., Zhang, L., Yang, H., Guo, J., Liao, N. and Yang, P. (2015), "Numerical simulation of thermal properties at Cu/Al interfaces based on hybrid model", Engineering Computations, Vol. 32 No. 3, pp. 574-584. https://doi.org/10.1108/EC-05-2013-0146

Publisher

:

Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited

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