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Thermal properties of modified carbon films

Jerzy Kalenik (Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland)
Konrad Kielbasinski (Institute of Electronic Materials, Warsaw, Poland)
Piotr Firek (Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland)
Elżbieta Czerwosz (Tele and Radio Research Institute, Warsaw, Poland)
Jan Szmidt (Warsaw University of Technology, Warsaw, Poland)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 2016

421

Abstract

Purpose

The purpose of this paper is to present thermal properties of palladium-carbon films prepared by physical vapour deposition (PVD)/chemical vapour deposition (CVD) methods.

Design/methodology/approach

Thin palladium-carbon films were prepared at Tele- and Radioresearch Institute. Test structures containing palladium-carbon films and titanium electrodes were made. Temperature-resistance characteristics were measured.

Findings

The results show strong temperature dependence of modified carbon film resistance. The dependence is stable, and so modified carbon films can be applied for various electronic applications.

Originality/value

The paper presents thermal properties of thin palladium-carbon prepared by original PVD/CVD method at Tele- and Radioresearch Institute.

Keywords

Acknowledgements

Authors would like to express their gratitude to National Center for Research and Development for finance support of this work as grant No. PBS1/A5/16/2012, “Light sources with field emitters” - “Zimlam”.

This project is co-financed by the European Regional Development Fund within the Innovative Economy Operational Programme 2007-2013 (title of the project “Development of technology for a new generation of the hydrogen and hydrogen compounds sensor for applications in above normative conditions” No UDA-POIG.01.03.01-14-071/08-09.

Citation

Kalenik, J., Kielbasinski, K., Firek, P., Czerwosz, E. and Szmidt, J. (2016), "Thermal properties of modified carbon films", Circuit World, Vol. 42 No. 1, pp. 37-41. https://doi.org/10.1108/CW-10-2015-0055

Publisher

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Emerald Group Publishing Limited

Copyright © 2016, Emerald Group Publishing Limited

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