Thermal analysis for foreign objects in high-power wireless power transfer systems

Abstract

Purpose

This paper aims to present a fast and modular framework implementation for the thermal analyses of foreign metal objects in the context of wireless power transfer (WPT) to evaluate whether they pose a hazard to the system. This framework serves as a decision-making tool for determining the necessity of foreign object detection in certain applications and at certain transmitted power levels.

Design/methodology/approach

To assess the necessity of implementing foreign object detection, the considered WPT system is modeled, and Arnoldi-Krylov-based model order reduction is applied to generate separate reduced models of the ground and vehicle modules of the WPT system. This enables interoperable evaluations to be conducted. Further discussion on the implementation details of the system-level simulations used to evaluate the electrical and thermal characteristics is provided. The resulting modular implementation allows for efficient evaluation of the thermal behavior of the wireless charging system at various transferred power levels and under various boundary conditions.

Findings

Based on the transferred power level, the WPT model, the relative positioning between the vehicle and the charging pad and the charging time, it may be necessary to divide the area of the charging pad into multiple regions for the purpose of implementing foreign object detection.

Originality/value

While the tools and fundamentals of thermal analysis are widely known and used, their application to high-power WPT systems for electric vehicles has not yet been thoroughly discussed in this form in the literature. The approach presented in this paper is not limited to the specific WPT model discussed but rather is directly applicable to other WPT models as well.

Citation

Tiemann, M., Clemens, M. and Schmuelling, B. (2023), "Thermal analysis for foreign objects in high-power wireless power transfer systems", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 42 No. 5, pp. 1187-1198. https://doi.org/10.1108/COMPEL-01-2023-0022