Analysis of chip formation mechanism in turning of AA 7075/SiCp MMCs
Aircraft Engineering and Aerospace Technology
ISSN: 0002-2667
Article publication date: 22 September 2023
Issue publication date: 13 November 2023
Abstract
Purpose
The purpose of this paper is to examine the quality of the turned surface. The quality of the surface produced depends on the nature of the chips, which are produced while turning metal matrix composites. This quality is a function of the machining parameters, tool material, tool configuration and elements of the composites.
Design/methodology/approach
In this study, the turning of AA7075/15 wt.% SiC (particle size 20–40 µm) composites is investigated. Thirty experiments were conducted, and the chip-formation mechanism in turning AA7075/SiCp composites at various combinations of cutting speeds, feed and depth of cuts was studied.
Findings
It is observed from the response surface methodology-based experimentation that in turning of coarser reinforcement (particle size 20–40 µm) composites, total gross fracture occurs. This causes small slices of chips and a higher shear plane angle. The nature of chips produced at various combinations of cutting speeds, feed and depth of cuts is different. The chips generated were segmented, spiral in cylindrical form, connected C type, chips with saw tooth, curled chips, washer C type chips, half-curved segmented chips and small-radii segmented chips.
Originality/value
The novelty of this research is that, so far, very little work has been published on the detailed analysis of chips produced during turning of AA7075/15 wt.% SiC (particle size 20–40 µm) composites.
Keywords
Acknowledgements
Funding: No funding was received for this research.
Ethics Statement: Research does not include studies on human subjects, human data or tissue or animals.
Citation
Bhushan, R.K. (2023), "Analysis of chip formation mechanism in turning of AA 7075/SiCp MMCs", Aircraft Engineering and Aerospace Technology, Vol. 95 No. 10, pp. 1659-1668. https://doi.org/10.1108/AEAT-11-2022-0309
Publisher
:Emerald Publishing Limited
Copyright © 2023, Emerald Publishing Limited