High performance liquid cooled aluminium nitride heat sinks
R. Hahn
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
V. Glaw
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
A. Ginolas
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
M. Töpfer
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
K. Wittke
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
H. Reichl
(Fruanhofer Institute IZM and Technical University, Berlin, Germany)
446
Abstract
High performance aluminium nitride water cooled heat sinks were fabricated and characterized. A variety of fabrication processes were employed to meet different cooling requirements. They include laser cut microchannel coolers for chip and multichip heat sinks as well as dry pressed pin fin heat sinks for power electronics. Thermal simulation was used to optimize the heat sink design.
Keywords
Citation
Hahn, R., Glaw, V., Ginolas, A., Töpfer, M., Wittke, K. and Reichl, H. (1999), "High performance liquid cooled aluminium nitride heat sinks", Microelectronics International, Vol. 16 No. 1, pp. 21-26. https://doi.org/10.1108/13565369910250050
Publisher
:MCB UP Ltd
Copyright © 1999, MCB UP Limited