Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing

Abstract

Temperature humidity acceleration factors for surface conductance are obtained to relate the reliability of film conductors formed by different processes. Analytical expressions for acceleration factor are evolved for both screen‐printed and laser micromachined conductor samples. The rapid solidification of metal conductors due to laser micromachining and its effect on surface conductance are also studied. An analytical expression for the most common accelerated test condition (85°C, 85% relative humidity) is also derived for both screen‐printed and laser micromachined samples.

Citation

Kripesh, V., Bhatnagar, S.K., Osterwinter, H. and Gust, W. (1996), "Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing", Microelectronics International, Vol. 13 No. 2, pp. 22-26. https://doi.org/10.1108/13565369610800296