Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing
Abstract
Temperature humidity acceleration factors for surface conductance are obtained to relate the reliability of film conductors formed by different processes. Analytical expressions for acceleration factor are evolved for both screen‐printed and laser micromachined conductor samples. The rapid solidification of metal conductors due to laser micromachining and its effect on surface conductance are also studied. An analytical expression for the most common accelerated test condition (85°C, 85% relative humidity) is also derived for both screen‐printed and laser micromachined samples.
Keywords
Citation
Kripesh, V., Bhatnagar, S.K., Osterwinter, H. and Gust, W. (1996), "Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing", Microelectronics International, Vol. 13 No. 2, pp. 22-26. https://doi.org/10.1108/13565369610800296
Publisher
:MCB UP Ltd
Copyright © 1996, MCB UP Limited