Future VLSI interconnects: optical fiber or carbon nanotube – a review

Abstract

Purpose

To review and explore optical fiber and carbon nanotube (CNT) as prospective alternatives to copper in VLSI interconnections.

Design/methodology/approach

As the technology moves to deep submicron level, the interconnect width also scales down. Increasing resistivity of copper with scaling and rising demands on current density drives the need for identifying new wiring solutions. This paper explores various alternatives to copper. Metallic CNTs, optical interconnects are promising candidates that can potentially address the challenges faced by copper.

Findings

Although, the theoretical aspects proves CNTs and optical interconnect to be better alternative against copper on the ground of performance parameters such as power dissipation, switching delay, crosstalk. But copper would last for coming decades on integration basis.

Originality/value

This paper reviews the state‐of‐the‐art in CNT interconnect and optical interconnect research; and discusses both the advantages and challenges of these emerging technologies.

Citation

Kaushik, B.K., Goel, S. and Rauthan, G. (2007), "Future VLSI interconnects: optical fiber or carbon nanotube – a review", Microelectronics International, Vol. 24 No. 2, pp. 53-63. https://doi.org/10.1108/13565360710745601