Enhancement of underfill encapsulants for flip‐chip technology

Abstract

This paper presents results on adding silane coupling agents to the underfill encapsulant to enhance the rheology and wetting of the underfill. These results include rheology measurements, contact angle measurements, and in situ flows using a simulated test chip on an FR4 with solder mask substrate. Three properties of the underfill encapsulant that can affect the mechanical reliability of the die and substrate assembly are: CTE; elastic modulus; and adhesion to the die and substrate surfaces. The approach taken in this paper is to add silane coupling agents with different chemistries to the underfill encapsulant to provide interfacial coupling of the underfill material to different die and substrate materials. This paper presents results on the enhancement of the adhesion of underfill encapsulant to silicon (Si), silicon nitride (SiN) die passivation, benzocyclobutene (BCB) die passivation, and solder mask surfaces. The adhesion strength was measured by die shear testing.

Citation

Vincent, M.B. and Wong, C.P. (1999), "Enhancement of underfill encapsulants for flip‐chip technology", Soldering & Surface Mount Technology, Vol. 11 No. 3, pp. 33-39. https://doi.org/10.1108/09540919910293856