Numerical modelling of solder joint formation

Abstract

Solder materials are used to provide a connection between electronic components and printed circuit boards (PCBs) using either the reflow or wave soldering process. As a board assembly passes through a reflow furnace the solder (initially in the form of solder paste) melts, reflows, then solidifies, and finally deforms between the chip and board. A number of defects may occur during this process such as flux entrapment, void formation, and cracking of the joint, chip or board. These defects are a serious concern to industry, especially with trends towards increasing component miniaturisation and smaller pitch sizes. This paper presents a modelling methodology for predicting solder joint shape, solidification, and deformation (stress) during the assembly process.

Citation

Bailey, C., Wheeler, D. and Cross, M. (1998), "Numerical modelling of solder joint formation", Soldering & Surface Mount Technology, Vol. 10 No. 2, pp. 6-13. https://doi.org/10.1108/09540919810219912